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![Analysis of Cooling by the Fan: Convection Carries away the Heat Source](https://www.tglobalcorp.com/upload/news_list_pic/enL_news_24B16_c0t8Buy4Qd.png)
Analysis of Cooling by the Fan: Convection Carries away the Heat Source
A fan is an aerodynamic machine that uses air to exert energy to increase the pressure and speed of the air. In a cooling system, a fan is used to accelerate the speed of the air to achieve a forced convection effect, carrying away more heat from the heat source.
![Get to the Main Point ! Heat Radiation in a Nutshell](https://www.tglobalcorp.com/upload/news_list_pic/enL_news_24B16_dJDBVQynNQ.png)
Get to the Main Point ! Heat Radiation in a Nutshell
Heat is transmitted in three ways: by conduction, convection and radiation. Heat radiation, when acting, is transmitted without any medium, just like the electromagnetic waves that transmit heat energy, or the heat of the sun transmitted through space to the earth.
![Important Trends in Thermal Dissipation in the 5G Era](https://www.tglobalcorp.com/upload/news_list_pic/enL_news_24B16_PcPEe0cdm7.png)
Important Trends in Thermal Dissipation in the 5G Era
The advent of the 5G era has led to the need for higher cooling technology, and for 5G phones to become commonly available, the problem of heat dissipation will have to be addressed not just for mobile phones, but for many other electronic products in the future, making the technology of heat dissipation the mainstream!
![T-Global 2021 T-Global subsidy project (Subsidy for Thermal Engineering Research Projects of Tertiary Institutions)](https://www.tglobalcorp.com/upload/news_list_pic/enL_news_24G18_3TI82wu4Ks.jpg)
T-Global 2021 T-Global subsidy project (Subsidy for Thermal Engineering Research Projects of Tertiary Institutions)
With the rapid development of science and technology, with the improvement of product functions and the refinement of the body, product antipyretic has become an indispensable factor for customers to consider. T-Global Technology has been established for 13 years, and it is still in the field of thermal conductivity. It is learning and growing with an open mind, pursuing breakthroughs, and is committed to the production and research, and development of thermal interface materials.