T-Global: 散熱管理解決方案

Thermal management uses conduction, convection, and radiation to maintain ideal temperatures in high-density electronics and industrial processes to avoid failures. Over time, thermal management solutions have progressed from air cooling to liquid and two-phase cooling systems using advanced materials. Yet, increased power densities and miniaturization exacerbate issues, including microelectronics localized overheating and high-power industrial heat dissipation. Therefore, continuous material and method innovation is needed.

Heat Transfer Mechanisms

Conduction in Thermal Management

Direct contact between materials transfers heat via conduction. Thermal management solutions must use this heat transfer mechanism in high-density electronics with restricted space. For example, due to its 2-3 times higher thermal conductivity than silicon, silicon carbide (SiC) might be employed in semiconductors. They transport heat away from microprocessors and power electronics hot spots for lower thermal runaway. In electric cars and semiconductor production, reaction-bonded silicon carbide (RB-SiC) components' low thermal expansion and high strength help preserve structural integrity and manage heat.

Convection in Thermal Management

Convection—heat moving through a fluid like air or liquid—helps create upgraded thermal management solutions. Liquid cooling systems are used in high-power applications, including battery electric vehicles (BEVs). They dissipate inverter and traction motor heat, which may surpass several kilowatts per hour via forced convection. Semiconductor process equipment relies on forced convection to regulate temperature through active cooling and yield uniformity. Even in small systems with high thermal loads, improved fin designs in heat sinks and radiators increase convective heat transfer coefficient and cooling efficiency.

Radiation in Thermal Management

Radiation transfers heat by electromagnetic waves when conduction and convection fail. Aerospace and satellite thermal management solutions must work in a vacuum, finding this important. CVD diamond, with 2200 W/m-K thermal conductivity, might help radiate heat. Such materials inhibit temperature deterioration in datacom/telecom systems to preserve signal integrity. Radiation heat transfer is also important in engineering spaceship thermal shields, which must manage high-temperature changes to protect electronics and equipment.

Materials and Systems in Thermal Management

Reaction-Bonded Si/SiC Materials

Due to its high-temperature resistance and low thermal expansion, reaction-bonded silicon carbide benefits thermal management solutions. RB-SiC suits high-power uses since it can function over 1500°C without deterioration. The material's low CTE lessens thermal stress in semiconductor production equipment, where temperature cycles often. RB-SiC's high strength-to-weight ratio provides structural stability and lightweight systems in aerospace and electric vehicles. RB-SiC components with internal cooling channels are designed for EV power electronics. That's where heat dissipation affects battery life and range.

AI/SiC Metal Matrix Composites

Aluminum silicon carbide (Al/SiC) metal matrix composites (MMC) are vital for thermal management owing to their high specific stiffness and thermal stability. They have a unique mix of low density and high thermal conductivity above 180 W/m-K for greater heat dissipation in important locations. Al/SiC may be customized to match other components' thermal expansion for lower thermal mismatch and better semiconductor equipment assembly life. Al/SiC MMCs may also be cast into huge, complicated structures over 2 meters for large-scale applications, including semiconductor lithography machine cooling plates. That's where uniform temperature over a wide surface is necessary for yield optimization.

CVD Diamond

Diamonds made from chemical vapor deposition (CVD) have a thermal conductivity that beats even copper. It renders CVD diamond ideal for thermal management solutions in high-density datacom/telecom. CVD diamond distributes heat fast and resists thermal shock to save components under grave settings. CVD diamond is also a heat spreader in high-power laser diodes to manage junction heat and avoid thermal damage for greater laser performance.

Single Crystal SiC

Single-crystal silicon carbide (SiC) has reshaped power electronics due to its better electrical qualities, including lower switching losses and higher thermal conductivity than silicon. Thermal management solutions in high-performance electric vehicles and telecoms need SiC's ability to handle larger power densities with reduced thermal resistance. 4H polytype SiC wafers have a thermal conductivity of around 342 W/m-K for heat dissipation in high-frequency and voltage devices. SiC's strong thermal conductivity and low electrical loss help produce broad bandgap semiconductors for next-generation power devices.

Thermoelectric Coolers

The Peltier effect allows thermoelectric coolers (TECs) to regulate temperature where standard cooling techniques are unfeasible. Solid-state TECs provide active cooling without moving components for lower mechanical failure and noise. They work well in sub-ambient cooling conditions, including infrared detectors and medical equipment. Temperature differentials of over 70°C below ambient temperature make TECs appropriate for thermal management solutions in sensitive applications. TECs are modular and can be scaled in arrays to control bigger heat loads in more complex systems across sectors.

Advanced Thermal Management Technologies

• Phase Change Materials (PCMs).

• Nano-engineered Coolants.

• Heat Pipes.

• Microchannel Heat Sinks.

• Thermoelectric Cooling.

• Liquid Metal Cooling.

• Vapor Chamber Technology.

• Contemporary Thermal Interface Materials (TIMs).

• Two-Phase Cooling Systems.

• Dielectric Liquid Immersion Cooling.

• Active Magnetic Regenerative Refrigeration (AMRR).

• High-Conductivity Graphene-Based Materials.

• Diamond Heat Spreaders.

• Thermally Conductive Polymers.

• Aerogel Insulation Materials.

• Thermal Energy Harvesting.

• Cold Plate Cooling.

• Pulsating Heat Pipes (PHP).

• Smart Cooling Systems (AI-Driven).

• Electrocaloric Cooling.

T-Global can integrate nearly all of the above-mentioned thermal management solutions. We focus on accuracy and efficiency in heat dissipation for many sectors, including 5G, AI, electric vehicles, and energy storage systems. Our thermal simulation and material sciences breakthroughs satisfy high-performance electronics' expanding needs. It puts us at the epicenter of thermal engineering to solve difficult thermal issues with customized solutions.

Thermal Management in Critical Applications

Thermal management is indispensable in aircraft, military, and healthcare applications. For instance, in aerospace and military applications, components must perform at high altitudes or conflict zones with high thermal loads and temperature swings. On the other hand, in healthcare, the accuracy of ultrasonography and wearable monitoring devices depends on thermal management to minimize overheating and guarantee patient safety.

T-Global provides thermal management solutions for numerous areas to satisfy these criteria. For example, our T62 Graphite Sheet is lightweight and has ultra-high thermal conductivity for aerospace and military applications with weight and space restrictions. High thermal performance is attained with our non-silicon thermal tapes and ceramic heat spreaders for medical applications. It allows high-precision equipment to operate unceasingly.

The Future of Thermal Management

• Passive cooling via metamaterials.

• Hybrid cooling systems (combining air, liquid, and thermoelectric).

• Smart textiles with integrated cooling.

• Embedded cooling systems for electronics.

• Adaptive thermal management using shape memory alloys.

• 3D-printed heat sinks and custom thermal solutions.

• Self-healing thermal management materials.

• Integrated thermal management for 5G and IoT devices.

• High-performance thermal management for EVs.

• Energy harvesting from waste heat.

• Photonic cooling techniques.

All of these trends and future advancements influence thermal management. At the same time, with our novel materials, thermal simulations, and industrial solutions, T-Global can lead such breakthroughs. We develop solutions to tomorrow's thermal dilemmas.

T-Global: Thermal Management Products

T-Global offers thermal management solutions across sectors as they become complex. E.g., vapor chambers, heat pipes, thermoelectric cooling chips, and TIMs like our TG-A4500 Ultra Soft Thermal Pad for precision medical devices are among our portfolio. We engage in thermal simulation using FloTHERM XT to boost designs early in development and drop R&D expenses while forecasting thermal performance in challenging settings. 

Apart from that, our customized thermal solutions, including non-silicon thermal tapes for high-resolution medical monitors, exemplify our ability to suit customer demands. Along these lines, please browse our thermal management solutions to discover the best match for your needs, supported by accuracy, creativity, and customer-centric service.