TG6060 Putty Thermal Putty
TG6060 Putty Thermal Putty
TG6060 Putty Thermal Putty
TG6060 Putty Thermal Putty

TG6060 Putty Thermal Putty

  • ●Silicone-type spacer with great long term reliability

  • ●Lower thermal resistance than thermal pads

  • ●Physical property between liquid and solid state

  • ●Elimination of different gap between heat source and the heatsink 

  • ●Can be applied  with dispenser


TG6060 is a thermal putty its 6.3W/m•K thermal conductivity also contains silicone cement.
This thermal pad is a relatively low thermal resistance due to its mud-like texture. Suitable for products with uneven heat sources. A small amount of cement can fill the gaps on the surface of the heat source to achieve excellent thermal conductivity. Compared with thermal paste, it is more convenient for construction and it has the characteristics of non-overflow and non-hardening. It is characterized by low thermal resistance, softness, strong plasticity, and environmental protection.

Application

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

This thermal pad has good plasticity and is filled in the heat source and heat sink in between, it can be easily used on uneven surfaces to eliminate air gaps and it can be operated with dispenser equipment. Widely used in network communication equipment, electronics, and automobiles components and other industries have physical characteristics between liquid and solid Performance, with excellent caulking effect.

 

OPERATION MANUAL

Push the latch and insert the stick

Put the tube in and twist

Close the cover

Take off the plug

 

Thermal Putty

 

  TG4040 TG-A7000
Thermal Conductivity 2.6 3.2 6.3 7.0
Viscosity @0.5rpm 5000 250(±100) 270(±50) 250
Density 2.6 2.9 3.3 3.25
Volume Resistivity 1014 1013 1013 1013
Working Temperature -50~+150 -50~+180 -50~+180 -50~+180
 

Property table

 

Properties Unit

TG4040

PUTTY

TG6060

PUTTY

Tolerance Test Method
Thermal Conductivity W/m•K

3.2

6.3

±0.3

ASTM D5470 Modified

Color

Blue

Viscosity 0.5rpm  Pa·s

250(±100)

270(±50)

Brookfield

Density g / cm3

2.9

3.3

±5%

ASTM D792

Volume Resistivity Ohm-mm

1013

ASTM D257

Operating Temperature °C

-50~+180

Standard package

Tube/Pot

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(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)

Related materials Recommended

TG-NSP25 Non-Silicone Thermal Putty

●Silicone free thermal gel

●Shapeable and compressible

●Low thermal resistance

●No fluidity

●Best for north bridge IC


TG-NSP25 non-silicone thermally conductive paste is a kind of silicone-free thermally conductive paste with 2.6W/m•K thermal conductivity. It has the character of sufficient compressibility and low thermal resistance. It can fill the gaps on the surface of the heat source with a small amount of mortar to achieve excellent thermal conductivity. Compared with thermal paste, it is more convenient for construction and has the characteristics of non-overflow and non-hardening.

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TG4040 Putty Thermal Putty
  • ●Silicone-type spacer with great long term reliability

  • ●Lower thermal resistance than thermal pads

  • ●Physical property between liquid and solid state

  • ●Elimination of different gap between heat source and the heatsink 

  • ●Can be applied  with dispenser


TG4040 is a thermal putty and a gap filler between solid and liquid with excellent thermal conductivity of 3.2W/m•K, low thermal resistance, and excellent long-term reliability. Only a small amount of TG putty is needed to fill the uneven gaps. This improves the flexible processability of the manufacturing end, is thinner, does not overflow, and does not harden, which is very suitable for components that do not require high-strength mechanical structural bonding, and provides better thermal conductivity.

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TG-A730AB / S730AB Potting Compound

●Good thermal conductivity

●Heat curing

●Can be applied with pistol

●Low viscosity

●Easy to assemble

S730 is a silicone potting compound with 2.1W/m•K thermal conductivity and the mixing ratio is 1:1 which is easy to mix, can be matched with an extrusion gun for easy operation and easy construction, S730 thermally conductive sealant also has high stability, low viscosity, and quick-drying And other excellent characteristics.

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