TG-A1450 Ultra Soft Thermal Pad
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●High thermal conductivity
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●Low thermal impedance
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●Good insulation
●High thermal conductivity
●Low thermal impedance
●Good insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1450 is an ultra-soft thermal pad that has a high conductivity of 14.5W/m•K, and it has excellent characteristics of low thermal resistance. It also has good protection under the condition of high thermal conductivity. The hardness reaches 55 (Shore OO), and it is not easy to warp or twist. It can be cut into pieces according to requirements or punched according to the drawing surface. It has good workability and increases the utilization rate of the production line. The thickness is available from 0.5mm to 2.0mm, with good market price and performance.
Application
Best for high power applications, high-wattage electronics such as electric vehicles, automation, 5G applications, servers, etc.
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
In recent years, all kinds of products have moved towards the aim of lightness, thinness, and shortness, but at the same time, the efficiency and power consumption have also increased by multiples, which has also led to the booming of heat dissipation and heat conduction issues. Under the greatly reduced space, the problem is how effectively the space can be used? TG-A1450 ultra-soft thermal pad is suitable for high-efficiency and high-power products. Because of the thermal conductivity efficiency, it can utilize superior thermal conductivity. Good softness and hardness can effectively fill the gaps in the applications. The manufacture is convenient and fast. It can be used in aeronautics, medical, automotive, electronics, and other fields.
Tearing off the release paper. |
Gently attach the thermally conductive silicon pad to the heat source. |
Remove the protective film |
Apply components onto the exposed part and apply pressure at fixture. |
TG-A20KX | TG-A2200 | TG-A3500 | TG-A38KX | TG-A4500 | |
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Thermal Conductivity | 2.0 | 2.2 | 3.5 | 3.8 | 4.5 |
Dielectric Breakdown | ≥12 | ≥13 | ≥13 | ≥10 | ≥10 |
Hardness (Shore OO) | 55 | 15 | 35 | 60 | 50 |
TG-A6200 | TG-A1250 | TG-A1450 | TG-A1660 | TG-A1780 | |
---|---|---|---|---|---|
Thermal Conductivity | 6.2 | 12.5 | 14.5 | 16.6 | 17.8 |
Dielectric Breakdown | ≥10 | ≥10 | ≥8 | ≥7 | ≥8 |
Hardness (Shore OO) | 50 | 55 | 55 | 65 | 70 |
Thermal Conductivity Thermal conductivity refers to the ability of a given material to conduct/transfer heat. |
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Dielectric Breakdown Voltage Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress. |
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Hardness Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials. |
Property table
Properties | Unit | TG-A1450 | Tolerance | Test Method |
Thermal Conductivity |
W/m•K |
14.5 |
±10% |
ASTM D5470 Modified |
Thickness |
mm |
0.5~ 2.0 |
– |
ASTM D374 |
inch |
0.0197~ 0.0787 |
– |
ASTM D374 |
|
Color |
– |
Pink |
– |
Colorimeter CIE 1976 |
Flame Rating |
– |
V-0 |
– |
UL 94 |
Dielectric Breakdown Voltage |
KV / mm |
≥8 |
- |
ASTM D149 |
Weight Loss |
% |
<1 |
– |
ASTM E595 Modified |
Density |
g / cm3 |
3.6 |
±5% |
ASTM D792 |
Operating Temperature | °C | -50~+180 | – | – |
Volume Resistivity | Ohm-m | 7x1012 | – | ASTM D257 |
Elongation |
% |
30 |
– |
ASTM D412 |
Standard Format |
– |
Sheet |
– |
– |
Hardness |
Shore OO |
55 |
±10 |
ASTM D2240 |
●Compliance with REACH ●Compliance with RoHS |
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●For thicknesses less than 1.0mm, hardness will be adjusted to 50-75 Shore OO to facilitate effective removal of liner during production |
(The above table is only for reference. For the latest SPEC please press the DATASHEET button for download)
Related materials Recommended
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●High thermal conductivity
-
●Low thermal impedance
-
●Good insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1780 thermal pad with a conductivity of 17.8W/m•K is one of the high-end products among T-Global's many thermal interface materials. TG-A1780 is a product with high thermal conductivity, which is suitable for Netcom products that have a budget and require fast heat conduction, as well as various product applications. Efficiently it can help you to solve thermal problems and fast heat transmission.
-
●High thermal conductivity
-
●Low thermal impedance
-
●Good insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1660 thermal pad has a high thermal conductivity 16.6W/m•K, the flexible characteristics of soft materials can be attached to uneven surfaces, which fully conducts the heat source to the metal shell or diffuser plate to improve the efficiency and service life of the heating electronic components.
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●High thermal conductivity up to 12.5 W/m•K
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●Low thermal resistance
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●High compressibility and compliancy
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●Electrical insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1250 is an entry-level high thermal conductivity silicon film with 12.5W/m•K. Since 2019, it has been widely used in various electronic products, among which unmanned transportation vehicles, edge computing, industrial control hosts, servers, and other industries are the most.