Thermal Interface Material

Potting Compound

S730 / TG-A730 Potting Compound
S730 / TG-A730 Potting Compound
S730 / TG-A730 Potting Compound
S730 / TG-A730 Potting Compound
S730 / TG-A730 Potting Compound

●Good thermal conductivity

●Heat curing

●Can be applied with pistol

●Low viscosity

●Easy to assemble

Application

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

Property table

Properties S730 / TG-A730 Unit Tolerance Test Method
Thermal Conductivity

2.1

W / mK

±10%

ASTM D5470

Color

Gray

Visual

Dielectric Breakdown Voltage

12.2

KV/mm

±1.2

ASTM D149

Volume Resistance

>1013

Ohm-m

ASTM D257

Density

2.5

g / cm3

±0.2

ASTM D792

Working Temperature

-50~ 200

°C

Viscosity

<50000

cps

ASTM D2393

Standard package

100g/ 1KG

Tube/Pot

Hardness

17

Shore A

±2

ASTM D2240

Curing Time @25°C 300 Min
Curing Time @60°C 30 Min
Curing Time @100°C 5 Min
Mixing ratio 1:1 gram
●Compliance with REACH  ●Compliance with RoHS
●Need samples?

●Silicone Potting Compound has a shelf-life of twelve (12) months from the date of manufacture, as indicated by the lot number, when stored in the original, unopened contained at or below 25° C.

●Component A is a mixed material of silicone and thermal conductive powder. It is normal to cause precipitation and stratification due to different density. Before use, please use a flat spatula or other stainless tools to evenly mix component A to achieve the best thermal conductivity.

(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)

Related materials Recommended

TG-NSP25 Non-Silicone Thermal Putty

●Silicone free thermal gel

●Shapeable and compressible

●Low thermal resistance

●No fluidity

●Best for north bridge IC

Submit
A96AB / TG-A96AB Potting Compound

●Epoxy based material with high hardness for support

●Protect components from any effect after curing

●Can be applied with dispenser

●Room temperature or heating curing

Submit
S720AB / TG-A720AB Potting Compound

●Good thermal conductivity

●Room temperature curing

●High stability 

●Water proof 

Submit
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