In accordance with the European Union’s General Data Protection Regulation (GDPR), we are committed to safeguarding and ensuring your control over your personal data. By clicking “Accept All” you are permitting us to use cookies to enhance your browsing experience, assist us in analyzing website performance and usage, and deliver relevant marketing content. You can manage your cookie settings below. By clicking “Confirm” you are agreeing to the current settings.
TG-V833 Phase Change Materials
- With the good flow ability over phase change temperature,surface irregularities can be well filled.
- Low thermal impedance
TG-V833 thermally conductive phase change material is solid at room temperature, which is convenient for customers to assemble. When the device reaches the working temperature, the material will melt into a liquid state, and fully fill the uneven gaps on the surface of the component with good fluidity to reduce Thermal resistance, improve the thermal conductivity of products, often used in chipsets, processors, semiconductors and other products.
TG-V833 thermally conductive phase change material, solid at room temperature, not only has the convenience of assembly, but also has good thermal conductivity, because it will melt into a liquid when it reaches a certain working temperature, and it will be better integrated with the device. It can fill up the unequal gaps on the surface of the component, reduce thermal resistance, and achieve better thermal conductivity. This product can be used in a variety of different needs, such as: often used in chipsets, processors, laptops, Power Supply, mobile phones, motherboards, and various electrical products.
Application:
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.