TG-T1000T Thermal Tape

  • Good adhesion(Acrylic PSA)
  • Great reliability
  • Cost effective with great performance
  • Easy to assemble
  • Customization services for different industries

It has high thermal conductivity, viscosity and low thermal resistance. It is a good replacement for thermal grease as the high viscosity can fix the electronic parts, which is also a great material for fill up the uneven surface between the heat source and heat sink , to transfer the heat to the heat sink finally achieve heat dissipation and lower the product’s temperature.

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Application:

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

  • Thermal Conductivity

    Thermal Conductivity

    Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
  • Dielectric Breakdown Voltage

    Dielectric Breakdown Voltage

    Dielectric breakdown is the failure of an insulating material to prevent the flow of currentunder an applied electrical stress.
Properties
Unit
TG-T1000T Thermal Tape
Testing methods
Thermal Conductivity
W/m•K
1.3±10%
ASTM D5470 Modified
Thickness
mm
0.11
ASTM D374
Color
Gray
Dielectric Breakdown Voltage (AC)
KV
≥4
ASTM D149
Dielectric Breakdown Voltage (DC)
KV
-
ASTM D149
Operating Temperature
°C
-40~+120
Density
g/cm³
1.5
ASTM D792
Reinforcement Carrier
PET
Tensile Strength
psi
-
ASTM D412
Short Time Use Temperature (30sec)
°C
200
Glass Transition Temperature
°C
-
Initial Tack
cm
24
PSTC-6
Lap Shear Strength
N/cm²
-
ASTM D1002
Die Shear Strength @25°C
N/cm²
-
Die Shear Strength @80°C
N/cm²
-
Holding Power1000g @25°Cusing 1 in²
min
>1000
PSTC-7
Holding Power1000g @80°Cusing 1 in²
min
-
PSTC-7
Peeling Strength 90° (Aluminum)
N/in
-
ASTM D3330
Peeling Strength 180° (Aluminum)
N/25mm
≥7
PSTC-101
Thermal Impedance @10psi
°C*in²/W
0.68
ASTM D5470 Modified
Thermal Impedance @30psi
°C*in²/W
0.66
ASTM D5470 Modified
Thermal Impedance @50psi
°C*in²/W
0.65
ASTM D5470 Modified
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