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Thermal Interface Materials
Thermal Paste(Thermally Conductive Grease)
TG-AS808 / TG-S808 Thermal Paste
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TG-AS808 / TG-S808 Thermal Paste
- High thermal conductivity
- Good leveling & no overflow
- Effectively fill up uneven surfaces
- Low thermal resistance/low thermal resistance
- Organic silicon base material has no environmental pollution
TG-AS808 is a thermal paste with 8 W/m•K thermal conductivity it has accumulated years of experience in the research and development of materials for T-Global. In the year 2019, it has launched as a conductive paste, which is also the highest coefficient of thermally conductive paste in the industry. It has good leveling and can effectively fill the unevenness of the metal contact surface. Improve thermal efficiency. Usually used for high-wattage wafers.
Under the condition of filling the mechanism space less than 0.1 mm in height, TG-AS808 thermal paste can be reused and applied to the required component interface in an appropriate amount. It has been widely used in the design of microprocessor modules for many years.
TG-AS808 thermal paste is suitable for use in electric locomotives, 5G servers, automated driving systems, mobile phones, artificial intelligence and the Internet of things, high-performance computing systems, servers, ICs, CPUs, MOS, LEDs, motherboards, power supplies, Heat sink, LCD-TV, notebook computer, PC, wireless telephone system, router, DDR ll Module, Netcom equipment, communication equipment, etc.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
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Find a high-purity solvent and cloth. |
Wipe the surface of the CPU and the entire heat sink assembly. |
Use the center-point application method. |
Spread the thermal paste evenly. |
Put the cover back on the heat sink. |
Properties
Unit
TG-AS808 / TG-S808 Thermal Paste
Testing methods
Thermal Conductivity
W/m•K
8±10%
ASTM D5470 Modified
Color
Gray
–
Oil Dispersible
wt%
<0.1
24hrs @150°C
Weight Loss
wt%
<0.1
ASTM E595 Modified
Viscosity
Pa•s
350±100
Brookfield
Density
g/cm³
2.9±5%
ASTM D792
Operating Temperature
°C
-40~+200
–
Volume Resistivity
Ohm-m
>10¹³
ASTM D257
Standard Package
Pot
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