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Thermal Interface Materials
Thermal Paste(Thermally Conductive Grease)
TG-AS606C / S606C Thermal Paste
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TG-AS606C / S606C Thermal Paste
- Good thermal conductivity
- Easy to assemble
- High stability
S606C is a thermal paste with a thermal conductivity of 5.3 W/m•K. This paste, also known as thermal compound, is primarily used to assist heat sinks, commonly in applications like computer IC wafers, to dissipate heat. Due to its ability to be applied in a thin layer, it minimizes the thickness of the thermal interface material, thereby reducing thermal resistance to the greatest extent.
TG-S606C is our company's largest-shipping product, with moderate thermal conductivity. It not only has an average level of overflow and K value but is also the most typical thermal paste for all non-high-power products. Since only a thin layer is applied during use, minimizing the thickness of the thermal interface material, thermal resistance is kept to a minimum. It is more suitable for robots, 3C electronics, and similar products. The paste can perfectly fill small gaps and address poor heat dissipation in these tight spaces. However, as the thermal paste gradually dries out over time due to heat conduction, it is less suitable for products that cannot be easily replaced, such as automotive applications.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
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Find a high-purity solvent and cloth. |
Wipe the surface of the CPU and the entire heat sink assembly. |
Use the center-point application method. |
Spread the thermal paste evenly. |
Put the cover back on the heat sink. |
Properties
Unit
TG-AS606C / S606C Thermal Paste
Testing methods
Thermal Conductivity
W/m•K
5.3±10%
ASTM D5470 Modified
Color
Gray
–
Oil Dispersible
wt%
<0.05
24hrs @150°C
Weight Loss
wt%
<0.5
ASTM E595 Modified
Viscosity
Pa•s
150±50
Brookfield
Density
g/cm³
2.95±5%
ASTM D792
Operating Temperature
°C
-40~+180
–
Volume Resistivity
Ohm-m
>10¹²
ASTM D257
Standard Package
Tube/Pot
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