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TG-AD75 Ultra Soft Thermal Pad
- High thermal conductivity
- Low thermal impedance
- Great electrical insulation
- High reliability and stability
This ultra-soft thermal pad has a high thermal conductivity and excellent compressibility, allowing it to effectively reduce thermal resistance and enhance heat dissipation performance.
Specifically developed for network communications, cloud computing, servers, TG-AD75 have outstanding thermal conductivity (7.5 W/m·K) and achieve an ultra-soft texture of Shore OO 25. Only a light amount of pressure is needed to achieve a seamless fit and fill the gaps between electronic components and heat sinks. This enables quicker and more effective heat dissipation, enhancing overall cooling performance.
Applications:
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Tearing off the release paper.
Attach the thermal pad to the heat source.
Remove the protective film.
Apply components onto the exposed part.
Thermal Conductivity
Dielectric Breakdown Voltage
Hardness