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TG-AD66 Ultra Soft Thermal Pad
- High thermal conductivity
- Low thermal impedance
- Good electrical insulation
This thermal pad's ultra-soft texture can effectively fill the gaps between electronic components and heat sinks, achieving a seamless fit.
Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries, TG-AD66 Ultra Soft Thermal Pad have outstanding thermal conductivity (6.5 W/m·K) and achieve an ultra-soft texture of Shore OO 25. Only a light amount of pressure is needed to achieve a seamless fit and fill the gaps between electronic components and heat sinks. This enables quicker and more effective heat dissipation, enhancing overall cooling performance.
Application:
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Tearing off the release paper.
Attach the thermal pad to the heat source.
Remove the protective film.
Apply components onto the exposed part.
Thermal Conductivity
Dielectric Breakdown Voltage
Hardness