TG-AD30 Ultra Soft Thermal Pad

  • High thermal conductivity
  • Low thermal impedance
  • Good electrical insulation

This thermal pad's ultra-soft texture can effectively fill the gaps between electronic components and heat sinks, achieving a seamless fit.

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Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries, these new products have outstanding thermal conductivity (3.0 W/m·K) and achieve an ultra-soft texture of Shore OO 20. Only a light amount of pressure is needed to achieve a seamless fit and fill the gaps between electronic components and heat sinks. This enables quicker and more effective heat dissipation, enhancing overall cooling performance.

 

Application:

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

How to use thermal pad

Tearing off the release paper

Tearing off the release paper.

Attach the thermal pad to the heat source

Attach the thermal pad to the heat source.

Remove the protective film

Remove the protective film.

Apply components onto the exposed part

Apply components onto the exposed part.

Thermal Conductivity

Thermal Conductivity

Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage

Dielectric Breakdown Voltage

Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress.
Hardness

Hardness

Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials.

 

Properties
Unit
TG-AD30 Ultra Soft Thermal Pad
Testing methods
Thermal Conductivity
W/m•K
3.0±10%
ASTM D5470 Modified
Thickness
mm
1.0~10.0
ASTM D374
Color
Purple
Colorimeter CIE 1976
Flame Rating
V-0
UL 94
Dielectric Breakdown Voltage
KV/mm
≥5
ASTM D149
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
3.05±5%
ASTM D792
Operating Temperature
°C
-50~+150
Volume Resistivity
Ohm-m
10¹²±10%
ASTM D257
Tensile Strength @T3.0mm
kgf/cm²
≤10
ASTM D412
Elongation
%
>150
ASTM D412
Standard Format
Sheet
Hardness(Silicone Side)
Shore OO
20±10
ASTM D2240

 

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