In accordance with the European Union’s General Data Protection Regulation (GDPR), we are committed to safeguarding and ensuring your control over your personal data. By clicking “Accept All” you are permitting us to use cookies to enhance your browsing experience, assist us in analyzing website performance and usage, and deliver relevant marketing content. You can manage your cookie settings below. By clicking “Confirm” you are agreeing to the current settings.
TG-A96AB / A96AB Potting Compound
- Epoxy based material with high hardness for support
- Protect components from any effect after cure
- Applicable with dispenser
- Cured by room temperature or heating
TG-A96AB / A96AB Potting Compound is a thermally conductive epoxy based potting compound used to protect electronics from moisture and other undesirable environmental factors. TG-A96AB / A96AB has thermal conductivity of 2.6W/m•K and cures at room temperature in just 10~12 hours. Using heat to assist the curing process reduces the curing time down to just 30 minutes. TG-A96AB / A96AB has a hardness of Shore A 68 which offers robust support for components.
In a wide range of temperature and humidity changes, it can reliably protect sensitive circuits and components for a long time. This compound has high waterproof and insulating properties and high hardness. It can be used for support. It cannot be opened after potting. It is especially suitable for potting products with thermal conductivity requirements. Protect. Suitable for insulation and thermal conductivity potting of electronics, transformers, and industrial controllers.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Properties
Unit
TG-A96AB / A96AB Potting Compound
Testing methods
Thermal Conductivity
W/m•K
2.6±0.25
ASTM D5470 Modified
Color
White/Black
–
Dielectric Breakdown Voltage
KV/mm
≥11
ASTM D149
Volume Resistivity
Ohm-m
-
ASTM D257
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
2.5±5%
ASTM D792
Operating Temperature
°C
-25~+150
–
Viscosity
Pa·s
1.8~2.5
Brookfield
Curing Time @25°C
12Hrs
–
Curing Time @60°C
-
–
Curing Time @80°C
0.5Hrs
–
Curing Time @100°C
-
–
Hardness
Shore
A 68±10
ASTM D2240
Mixing Ratio
gram
13:1
–
Standard Package
Pot
–