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TG-A6200LC High Performance Thermal Pad
- Great thermal conductivity
- Difficult to be deformed
- Easy to assemble
- One side low tack
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Tearing off the release paper.
Attach the thermal pad to the heat source.
Remove the protective film.
Apply components onto the exposed part.
Thermal Conductivity
Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage
Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress.
Hardness
Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials.
Properties
Unit
TG-A6200LC High Performance Thermal Pad
Testing methods
Thermal Conductivity
W/m•K
5.0±10%
ASTM D5470 Modified
Thickness
mm
0.5~2.5
ASTM D374
Color
Pad-Blue
LC-Green
Colorimeter CIE 1976
Flame Rating
V-0
UL 94
Dielectric Breakdown Voltage
KV/mm
≥6
ASTM D149
Reinforcement Carrier
-
–
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
3
ASTM D792
Operating Temperature
°C
-50~+180
–
Volume Resistivity
Ohm-m
1x10¹⁰
ASTM D257
Elongation
%
50
ASTM D412
Standard Format
Sheet
–
Hardness(Silicone Side)
Shore OO
50±10
ASTM D2240