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TG-A5000L Low Bleed Thermal Pad
- Low bleed
- High compressibility
- Self-adhesive
- High thermal conductivity
This product effectively inhibits silicon oil separation, reduces concerns of potential overflow, and increases material stability and durability.
The TG-A5000L boasts a high conduction coefficient of 5.0W/m•K and is specifically engineered to meet the demands of high-performance computing. With advanced low bleed technology and excellent heat resistance, this material ensures devices can maintain stability and reliability at high temperatures, even during extended periods of operation.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Tearing off the release paper.
Attach the thermal pad to the heat source.
Remove the protective film.
Apply components onto the exposed part.
Thermal Conductivity
Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage
Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress.
Hardness
Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials.
Properties
Unit
TG-A5000L Low Bleed Thermal Pad
Testing methods
Thermal Conductivity
W/m•K
5.0±10%
ASTM D5470 Modified
Thickness
mm
0.5~8.0
ASTM D374
Color
Yellow
Colorimeter CIE 1976
Flame Rating
V-0
UL 94
Dielectric Breakdown Voltage
KV/mm
≥6
ASTM D149
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
3.4±5%
ASTM D792
Operating Temperature
°C
-50~+150
–
Volume Resistivity
Ohm-m
10¹²±10%
ASTM D257
Bleeding Width
mm
<3
T-Global Test Method
Elongation
%
90
ASTM D412
Standard Format
Sheet
–
Hardness(Silicone Side)
Shore OO
35｜±10
ASTM D2240