In accordance with the European Union’s General Data Protection Regulation (GDPR), we are committed to safeguarding and ensuring your control over your personal data. By clicking “Accept All” you are permitting us to use cookies to enhance your browsing experience, assist us in analyzing website performance and usage, and deliver relevant marketing content. You can manage your cookie settings below. By clicking “Confirm” you are agreeing to the current settings.
TG-A404F / TG4040F Ultra Soft Thermal Pad
- Very good thermal conductivity
- Compliancy, high compressibility
- Fiberglass on one side
- Non deforming; high tensile strength
- Electrical insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
This is the old series thermal pads, please contact our product consultant if you got any inquiry.
The new TG-A series thermal pad has better performance on the thermal conductivity, compressibility, with the ultra-soft softness, low thermal resistance and naturally tacky’s characteristics. It is often used as an interface material for IC and electronic heat dissipation, and is equipped with a heat pipe, vapor chamber and cooling modules.
Recommended ultra soft thermal pad Series
![]() |
TG-A4500F Ultra Soft Thermal Pad |
Thermal Conductivity:4.0 W/m•K ±10% |
Hardness:Shore OO 50 ±15 |
Dielectric Breakdown Voltage:≥11 KV/mm |