In accordance with the European Union’s General Data Protection Regulation (GDPR), we are committed to safeguarding and ensuring your control over your personal data. By clicking “Accept All” you are permitting us to use cookies to enhance your browsing experience, assist us in analyzing website performance and usage, and deliver relevant marketing content. You can manage your cookie settings below. By clicking “Confirm” you are agreeing to the current settings.
TG-A38KX High Performance Thermal Pad
- Great thermal conductivity
- Difficult to be deformed
- Easy to assemble
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A38KX has great thermal conductivity, it’s difficult to be deformed and easy to assemble. With Protection, impact absorption, flame resistance, and good fit.
【Suitable for low-power products 】
This high-performance thermal pad has a very good gap-filling ability, good temperature resistance, and it can work firmly at -40°C~200°C. The material has high electrical insulation and self-adhesiveness, and no additional adhesive is required to delay heat conduction. Widely used in industry, electronics, automotive components, Power supply and other industries, high thermal conductivity, and low cost.
Application:
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Tearing off the release paper.
Attach the thermal pad to the heat source.
Remove the protective film.
Apply components onto the exposed part.
Thermal Conductivity
Dielectric Breakdown Voltage
Hardness