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TG-A375S / L37-5S Thermal Pad
- Best for filling the gap
- Compliancy, high compressibility
- Ultra soft, low hardness (Shore OO)
- Lower pressure to heated components or PCB
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
This is the old series thermal pads, please contact our product consultant if you got any inquiry.
The new TG-A series thermal pad has better performance on the thermal conductivity, compressibility, with the ultra-soft softness, low thermal resistance and naturally tacky’s characteristics. It is often used as an interface material for IC and electronic heat dissipation, and is equipped with a heat pipe, vapor chamber and cooling modules.
Recommended ultra soft thermal pad Series
 |
| TG-A3500 Ultra Soft Thermal Pad |
| Thermal Conductivity：3.5W/m•K ±10% |
| Hardness：Shore OO 35 ±15 |
| Dielectric Breakdown Voltage：≥ 13 KV/mm |
Properties
Unit
TG-A375S / L37-5S Thermal Pad
Testing methods
Thermal Conductivity
W/m•K
1.9±10%
ASTM D5470 Modified
Thickness
mm
0.5~5.0
ASTM D374
Color
Gray
Colorimeter CIE 1976
Flame Rating
V-0
UL 94
Dielectric Breakdown Voltage
KV/mm
≥16.3
ASTM D149
Reinforcement Carrier
-
–
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
2.4±5%
ASTM D792
Operating Temperature
°C
-45~+200
–
Volume Resistivity
Ohm-m
>10¹⁰
ASTM D257
Elongation
%
300
ASTM D412
Standard Format
Sheet
–
Hardness(Silicone Side)
Shore OO
20｜±10
ASTM D2240