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TG-A20KX High Performance Thermal Pad

  • Great thermal conductivity
  • Difficult to be deformed
  • Easy to assemble

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.TG-A20KX - is a new product developed by T-Global in the year 2020. It is a thermally conductive silicone film with 2.0W/m•K thermal conductivity and the thermal conductivity is hard to deform, it has a good structure and good thermal conductivity, and double-mask self-adhesiveness. It effectively reduces the thermal resistance between the surface of the heat source and the contact surface of the heat sink

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Suitable for low-power products 

At present, in response to the rise of the electric vehicle industry, this thermally conductive silicon film can be widely used in the automotive industry, such as car lamps and car projection lamps.

 

Application:

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

How to use thermal pad

Tearing off the release paper

Tearing off the release paper.

Attach the thermal pad to the heat source

Attach the thermal pad to the heat source.

Remove the protective film

Remove the protective film.

Apply components onto the exposed part

Apply components onto the exposed part.

Thermal Conductivity

Thermal Conductivity

Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage

Dielectric Breakdown Voltage

Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress.
Hardness

Hardness

Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials.

 

Properties
Unit
TG-A20KX High Performance Thermal Pad
Testing methods
Thermal Conductivity
W/m•K
2.0±10%
ASTM D5470 Modified
Thickness
mm
0.3~10.0
ASTM D374
Color
Dark Gray
Colorimeter CIE 1976
Flame Rating
V-0
UL 94
Dielectric Breakdown Voltage
KV/mm
≥12
ASTM D149
Reinforcement Carrier
-
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
2±5%
ASTM D792
Operating Temperature
°C
-40~+180
Volume Resistivity
Ohm-m
3x10¹²
ASTM D257
Elongation
%
160
ASTM D412
Standard Format
Sheet
Hardness(Silicone Side)
Shore OO
55±8
ASTM D2240

 

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