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TG-A20KF High Performance Thermal Pad
- Great thermal conductivity
- Difficult to be deformed
- Easy to assemble
- Fiberglass on one side
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A20KF is a glass fiber thermal conductive silicone material with1.8W/m•K thermal conductivity. At the same time, it has self-adhesive, glass fiber features, is puncture-resistant, and is not easy to deform. Normal operation at -40 to +180 degrees C, not only safe but also for applications that need to provide heat sinks for the device and high-voltage equipment, it can also produce great heat conduction benefits, providing excellent heat conduction and insulation performance.
Suitable for low-power products
Thermally conductive silicon film with glass fiber is commonly used in communication and power conversion. It can transfer heat, has good insulation, and is not easy to twist. It is the best appropriate material between heat-generating semiconductors and magnetic parts. Especially for the needs of some components, the general thermal conductive silicon film is susceptible to be difficult and easy to deform. So the solution of adding a single-sided glass fiber substrate to thermally conductive silicon film came into being. TG-A20KF with glass fiber attached to the surface can increase the toughness of the thermally conductive silicon film and has better abrasion resistance. It can reinforce the silicon film with only thermally conductive powder, especially the shortcomings of easy deformation during construction with screw components. It is not easy to be damaged, which greatly increases the convenience of construction on the production line.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Tearing off the release paper.
Attach the thermal pad to the heat source.
Remove the protective film.
Apply components onto the exposed part.
Thermal Conductivity
Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage
Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress.
Hardness
Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials.
Properties
Unit
TG-A20KF High Performance Thermal Pad
Testing methods
Thermal Conductivity
W/m•K
1.8±10%
ASTM D5470 Modified
Thickness
mm
0.5~10.0
ASTM D374
Color
Dark Gray
Colorimeter CIE 1976
Flame Rating
V-0
UL 94
Dielectric Breakdown Voltage
KV/mm
≥13
ASTM D149
Reinforcement Carrier
Fiberglass Mesh
–
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
2.1±5%
ASTM D792
Operating Temperature
°C
-40~+180
–
Volume Resistivity
Ohm-m
3×10¹²
ASTM D257
Elongation
%
160 (Silicone Side)
ASTM D412
Standard Format
Sheet
–
Hardness(Silicone Side)
Shore OO
55±8
ASTM D2240