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TG-A1450 Ultra Soft Thermal Pad
- High thermal conductivity
- Low thermal impedance
- Good insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1450 is an ultra-soft thermal pad that has a high conductivity of 14.5W/m•K, and it has excellent characteristics of low thermal resistance. It also has good protection under the condition of high thermal conductivity. The hardness reaches 55 (Shore OO), and it is not easy to warp or twist. It can be cut into pieces according to requirements or punched according to the drawing surface. It has good workability and increases the utilization rate of the production line. The thickness is available from 0.5mm to 2.0mm, with good market price and performance.
Best for high power applications, high-wattage electronics such as electric vehicles, automation, 5G applications, servers, etc. In recent years, all kinds of products have moved towards the aim of lightness, thinness, and shortness, but at the same time, the efficiency and power consumption have also increased by multiples, which has also led to the booming of heat dissipation and heat conduction issues. Under the greatly reduced space, the problem is how effectively the space can be used? TG-A1450 ultra-soft thermal pad is suitable for high-efficiency and high-power products. Because of the thermal conductivity efficiency, it can utilize superior thermal conductivity. Good softness and hardness can effectively fill the gaps in the applications. The manufacture is convenient and fast. It can be used in aeronautics, medical, automotive, electronics, and other fields.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Tearing off the release paper.
Attach the thermal pad to the heat source.
Remove the protective film.
Apply components onto the exposed part.
Thermal Conductivity
Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage
Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress.
Hardness
Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials.
Properties
Unit
TG-A1450 Ultra Soft Thermal Pad
Testing methods
Thermal Conductivity
W/m•K
14.5±10%
ASTM D5470 Modified
Thickness
mm
0.5~2.0
ASTM D374
Color
Pink
Colorimeter CIE 1976
Flame Rating
V-0
UL 94
Dielectric Breakdown Voltage
KV/mm
≥8
ASTM D149
Reinforcement Carrier
-
–
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
3.6±5%
ASTM D792
Operating Temperature
°C
-50~+180
–
Volume Resistivity
Ohm-m
7×10¹²
ASTM D257
Elongation
%
30
ASTM D412
Standard Format
Sheet
–
Hardness(Silicone Side)
Shore OO
55±10
ASTM D2240