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TG-A1250 Ultra Soft Thermal Pad
- High thermal conductivity up to 12.5 W/m•K
- Low thermal resistance
- High compressibility and compliancy
- Electrical insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1250 is an entry-level high thermal conductivity silicon film with 12.5W/m•K. Since 2019, it has been widely used in various electronic products, among which unmanned transportation vehicles, edge computing, industrial control hosts, servers, and other industries are the most.
It is generally used to fill the gap between the high power applications and the heatsink, or the gap in between related components.
Application:
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Tearing off the release paper.
Attach the thermal pad to the heat source.
Remove the protective film.
Apply components onto the exposed part.
Thermal Conductivity
Dielectric Breakdown Voltage
Hardness