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Potting Compound
TG-A09AB / TG-S09AB Potting Compound
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TG-A09AB / TG-S09AB Potting Compound
- Good thermal conductivity
- Protect based material with high hardness for support
- A:B=1:1
- Room temperature or heating curing
TG-A09AB / TG-S09AB: is the thermally conductive sealant product newly developed by T-Global. Compared with the same type of silicone thermal conductive sealant, the thermal conductivity can reach 2.8W/m•K, it only takes 18 hours to cure the room temperature, and it only takes 30 minutes to heat and cure. After curing, it can protect electronic parts and prevent moisture and protect. 。
In the modern era of the rapid rise of electric vehicles, Both the battery and the motor need to be filled with a potting curing sealant to achieve the effect of protection, waterproofing, and insulation, but the internal heat must be effectively conducted and dissipated. At this time, TG-A09AB / TG-S09AB silicone thermal conductive sealant is one it is a very good choice. Compared with other types of silicone sealant, TG-A09AB / TG-S09AB silicone type thermal conductive sealant has a superior thermal conductivity of 2.8W/m•K, fast curing time, and good AB glue storage method, which is not easy to store.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Properties
Unit
TG-A09AB / TG-S09AB Potting Compound
Testing methods
Thermal Conductivity
W/m•K
2.8±10%
ASTM D5470 Modified
Color
Gray (Mix)
–
Dielectric Breakdown Voltage
KV/mm
≥11
ASTM D149
Volume Resistivity
Ohm-m
≥10¹²
ASTM D257
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
2.52±5%
ASTM D792
Operating Temperature
°C
-50~+150
–
Viscosity
Pa·s
10~50
Brookfield
Curing Time @25°C
6±10%
–
Curing Time @80°C
0.08±10%
–
Hardness
Shore
OO 90±10
ASTM D2240
Mixing Ratio
gram
1:1
–
Standard Package
Pot
–