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GT30 Thermal Pad
- Smooth surface & low contact resistance
- Usable over a wide temperature range
- Electrical insulation; high breakdown voltage
- Complies with UL standards
GT30 is a thermal pad with glass fiber as the main body and it’s with 3.2W/m·K thermally conductive silicon film, it has the characteristics of insulation
5G and Netcom are a major trend in recent years. High efficiency also means high power, and machinery and equipment must withstand higher voltages. Modern electronic devices also chase magnificence, smallness, and exquisiteness. IC chips are becoming smaller and smaller. The high-efficiency and hot-prone mechanism conditions are also restricted. Under the requirements of voltage and space environment, the ultra-thin GT30D will be your best choice. Taking glass fiber as the theme and adding thermally conductive powder, it has the characteristics of lightness, high voltage resistance, insulation, and high tensile strength. Suitable for 5G, Netcom, and power supply devices in a higher power and high voltage environments.
Applications：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Tearing off the release paper.
Attach the thermal pad to the heat source.
Remove the protective film.
Apply components onto the exposed part.
Thermal Conductivity
Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage
Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress.
Hardness
Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials.
Properties
Unit
GT30 Thermal Pad
Testing methods
Thermal Conductivity
W/m·K
3.2±10%
ASTM D5470 Modified
Thickness
mm
0.35
ASTM D374
Color
粉红
Colorimeter CIE 1976
Flame Rating
V-0
UL 94
Dielectric Breakdown Voltage
kV/mm
≥3.1
ASTM D149
Reinforcement Carrier
玻纖
–
Weight Loss
%
<0.2
ASTM E595 Modified
Density
g/cm³
2.8
ASTM D792
Operating Temperature
°C
-45~+180
–
Volume Resistivity
Ohm·m
>10¹⁰
ASTM D257
Elongation
%
30
ASTM D412
Standard Format
單片狀
–
Hardness(Silicone Side)
Shore A
70±3
ASTM D2240