TG-A1780 Ultra Soft Thermal Pad

  • High thermal conductivity
  • Low thermal impedance
  • Good insulation

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1780 thermal pad with a conductivity of 17.8W/m•K is one of the high-end products among T-Global's many thermal interface materials. TG-A1780 is a product with high thermal conductivity, which is suitable for Netcom products that have a budget and require fast heat conduction, as well as various product applications. Efficiently it can help you to solve thermal problems and fast heat transmission. 

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Best for high power applications, high-wattage electronics such as electric vehicles, automation, 5G applications, servers, etc. TG-A1780 is a product with high thermal conductivity, which can help you solve the thermal problem with high efficiency. The customized product size and graphics are your first choice for fast heat conduction. The product size and design can be customized for fast heat conduction. It is suitable for Netcom products and a variety of different product applications. For example the most popular electric vehicle-related applications (including the system control panel in the car or the heat conduction solution required by the car chip), cloud applications, artificial intelligence, 5G base stations, automatic driving, and other products. It is suitable to use this high-performance thermal conductive material.

 

Application:

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

How to use thermal pad

Tearing off the release paper

Tearing off the release paper.

Attach the thermal pad to the heat source

Attach the thermal pad to the heat source.

Remove the protective film

Remove the protective film.

Apply components onto the exposed part

Apply components onto the exposed part.

Thermal Conductivity

Thermal Conductivity

Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage

Dielectric Breakdown Voltage

Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress.
Hardness

Hardness

Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials.

 

Properties
Unit
TG-A1780 Ultra Soft Thermal Pad
Testing methods
Thermal Conductivity
W/m•K
17.8±10%
ASTM D5470 Modified
Thickness
mm
0.5~2.0
ASTM D374
Color
Light Gray
Colorimeter CIE 1976
Flame Rating
V-0
UL 94
Dielectric Breakdown Voltage
KV/mm
≥8
ASTM D149
Reinforcement Carrier
-
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
3.5±5%
ASTM D792
Operating Temperature
°C
-50~+180
Volume Resistivity
Ohm-m
6x10¹²
ASTM D257
Elongation
%
20
ASTM D412
Standard Format
Sheet
Hardness(Silicone Side)
Shore OO
70|±10
ASTM D2240
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