TG-APC94 / PC94 Non-Silicone Thermal Pad
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●Non siloxane and oil-bleed
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●Ultra soft and great elongation
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●Very low thermal impedance
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●Electrical insulation
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●Great thermal conductivity
●Non siloxane and oil-bleed
●Ultra soft and great elongation
●Very low thermal impedance
●Electrical insulation
●Great thermal conductivity
PC94 is a Non-Silicone thermal high-performance thermal conductive material that does not contain silicone components. There will be no silicone resin volatilization or silicone oil precipitation, which reduces the possibility of circuit failure. This is recommended when the presence of silicone oil may be harmful to product performance. Non-silicone materials, which can improve the efficiency and service life of heating electronic components.
Application
Best for hard disk
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, etc.
There is nothing better than optical instruments and silicon-sensitive equipment to choose the use of this silicone-free thermally conductive silicone film. As long as you feel any doubt or anxiety about the existence of silicone oil, it is recommended that you consider using this material, whether it is Power battery packs, car navigation, optical precision equipment, camera equipment, mobile communication equipment, organic silicon sensitive applications, high-end industrial control, and medical electronics, etc., may be found in electronic components that generate heat. This is another option specially developed for users who have doubts about silicone oil.
Property table
Properties | Unit | TG-APC94 | Tolerance | Test Method |
Thermal Conductivity |
W/m•K |
4.2 |
±10% |
ASTM D5470 Modified |
Thickness |
mm |
0.5~5.0 |
– |
ASTM D374 |
inch |
0.0197~ 0.1969 |
– |
ASTM D374 |
|
Color | – | Red | – | Colorimeter CIE 1976 |
Flame Rating |
– |
V-0 |
– |
UL 94 |
Dielectric Breakdown Voltage |
KV / mm |
≥10.2 |
– |
ASTM D149 |
Weight Loss |
% |
<1 |
– |
ASTM E595 Modified |
Density |
g / cm3 |
2.5 |
±0.2 |
ASTM D792 |
Operating Temperature |
°C |
-30~+125 |
– |
– |
Volume Resistivity |
Ohm-m |
>1010 |
– |
ASTM D257 |
Elongation |
% |
100 |
– |
ASTM D412 |
Tensile Strength |
Kgf / cm2 |
2 |
– |
ASTM D412 |
Standard Format |
– |
Sheet |
– |
– |
Hardness |
Shore OO |
50 |
±10 |
ASTM D2240 |
●Compliance with REACH ●Compliance with RoHS ●Compliance with UL | ||||
●For thicknesses less than 1.0mm, hardness will be adjusted to 50-75 Shore OO to facilitate effective removal of liner during production ●Die-cut for different shapes |
(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
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●High thermal conductivity
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●High compressibility and compliancy
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●Natural tack
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A6200 thermal pad with 6.2W/m•K and it can perfectly attach to the heat source. With good thermal conductivity, high compressibility, self-adhesion and insulation.
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●Very good thermal conductivity
-
●High compressibility and compliancy
-
●Natural tack
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
-
●Very good thermal conductivity
-
●High compressibility and compliancy
-
●Natural tack
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.