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2024.12.10
Product News
Engineered for High-Speed Computing – High-Performance Ultra-Soft Thermal Pad
Engineered for High-Speed Computing – High-Performance Ultra-Soft Thermal Pad
The high-speed computing industries, including networking, cloud computing, and servers, generate significant heat due to data processing and complex calculations. This heat can lead to reduced chip performance, slower data processing speeds, and even shortened product lifespans. Efficient thermal management is essential to maintain stable operating temperatures and ensure the optimal performance of electronic components.
T-Global Technology is committed to providing comprehensive thermal solutions and has developed cutting-edge materials tailored to the evolving demands of technology. We proudly introduce two market-leading products: the TG-AD30 and TG-AD66 ultra-soft thermal pads. With a thermal conductivity range of 3.0-6.5 W/m·K and an exceptionally soft texture (Shore OO 20), these pads achieve a perfect fit under low pressure, effortlessly filling the microscopic gaps between electronic components and heat sinks.
When compressed, the pads' ultra-soft nature adjusts their thickness, further optimizing the interface for thermal contact. This enables an outstanding thermal resistance as low as 0.01 °C*in²/W, allowing for efficient heat transfer. These innovative pads address the critical challenge of heat dissipation in electronic components, ensuring stable chip operating temperatures and extending product lifespans.
