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Product News
【Two New Ultra-Soft High Conductivity Thermal Pads Have Gone to Market】
【Two New Ultra-Soft High Conductivity Thermal Pads Have Gone to Market】Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries, these new products have outstanding thermal conductivity (6.5-7.5 W/m·K) and achieve an ultra-soft texture of Shore OO 25. Only a light amount of pressure is needed to achieve a seamless fit and fill the gaps between electronic components and heat sinks. This enables quicker and more effective heat dissipation, enhancing overall cooling performance.
2024.05.03
Product News
NEW ARRIVALS - TG-N8000 Non-Silicone Thermal Putty
The new product boasts a high thermal conductivity coefficient of 8 W/m·K, contains no added silicone oil (which may lead to volatile low-molecular siloxanes, posing a serious risk to electrical contacts). The product is eco-friendly and ideal for optical products (REACH compliant), Advanced Driver Assistance Systems (ADAS), and sensitive electronic components.
2023.08.10
Product News
TG-A series product announcement
The continued advancement of the technology industry has seen a sharp rise in market demands for improved thermal management solutions which often means that thermal interface materials are upgraded as new products and technologies are developed and brought to market.
2023.04.26
Product News