There is an advanced cooling technology ecosystem in Taiwan.

Over than 90% of servers which was used in data centers were produced by Intel which headquarter is in Taiwan.

Intel Taiwan launched an Open IP(Open Intellectual Property) Immersion Cooling Modular Reference Solutions which will authorized to the partner.

Intel said that the first phase of Open IP Immersion Cooling Modular Reference Solutions uses single-phase Immersion cooling which immerse the server in a non-conductive liquid.

The design of the single sink is based on the quantity of 12U and the cooling capacity of 15KW.

It is available in 24U, 36U, 48U, and currently the cooling capacity in a single sink us up to 180kw( The design will be available with upgrades the system and increases the cooling capacity in the future).

Recently the concept of Intel Xeon Scalable Processor has been approved and can easily reach 1.15 PUE. Surpassing Green Grid alliance toppest PUE smaller than 1.25. In the future optimizing system and Server setting can help set the PUE to under 1.07. Recently practical application concept for data center will be accomplished in the first time and being introduce to other nations across the globe. Now there’s plenty of system integrator showing interest in ways to dissipating heat.

Intel pointed out that by 2025, the power density of each rack in the data center will be greatly increased, and the capacity of One-Phase Immersion Cooling with Submer has been developed to 30-180kW to correspond. In the second phase, it is expected to establish a data center sustainable solution laboratory in Taiwan to jointly develop and verify various solutions with partners. In the third phase, a complete solution for two-phase immersion liquid cooling will be further introduced to continuously increase the power density that can be accommodated per unit.

Author

Professor Wei-Keng Lin

Education｜Ph.D., University of Maryland

Occupation｜Professor, National Tsing Hua University 

Specialty｜Electronic package heat dissipation, Heat pipe, Loop heat pipes(CPL，LHP，PHP), Energy-saving design, Solar heat storage and cooling, Heat flow system, Cooling of electronic components, Two-phase flow, Heat transfer elements of artificial satellite and high-altitude flying object