In accordance with the European Union’s General Data Protection Regulation (GDPR), we are committed to safeguarding and ensuring your control over your personal data. By clicking “Accept All” you are permitting us to use cookies to enhance your browsing experience, assist us in analyzing website performance and usage, and deliver relevant marketing content. You can manage your cookie settings below. By clicking “Confirm” you are agreeing to the current settings.
![What is a heat dissipation module?](https://www.tglobalcorp.com/upload/news_list_pic/enL_news_24H06_wi9PAB7OjN.jpg)
What is a heat dissipation module?
A heat dissipation module is a component used for cooling systems, devices, or equipment. The immense computing power of AI leads to higher power consumption and heat generation, making heat dissipation modules essential for temperature management.
![What is chip cold plate liquid cooling?](https://www.tglobalcorp.com/upload/news_list_pic/202406EC-02__24E163x8EU.png)
What is chip cold plate liquid cooling?
The cold plate of a chip is placed above the heat-generating components (CPU, GPU, memory modules) and absorbs and removes the heat from the chip through either single-phase or two-phase cold plates. Single-phase cold plate liquid cooling uses coolant circulating through the cold plate via the CDU to absorb the heat from the server.