【New Product Launch 】TG-4000 Non-Silicone Thermal Putty

【New Product Launch 】TG-4000 Non-Silicone Thermal Putty

This hybrid liquid and solid-state thermal conduction putty has low thermal impedance and contains non-volatile siloxane. It is suitable for optical and sensitive electronic components.

2024.05.17
Product News
Liv2 Thermal Tape in Car Assembly Industry

Liv2 Thermal Tape in Car Assembly Industry

Comic
【Event Recap】Campus Engagement and EV Industry Expansion Both at Home and Abroad! Experts in Heat Dissipation and Thermal Conduction, T-Global Showcase Technical Prowess at the Taipei AMPA Exhibition.

【Event Recap】Campus Engagement and EV Industry Expansion Both at Home and Abroad! Experts in Heat Dissipation and Thermal Conduction, T-Global Showcase Technical Prowess at the Taipei AMPA Exhibition.

The Taipei International Automobile & Motorcycle Parts & Accessories Show (Taipei AMPA), which ranks among the world's four largest and Asia's second-largest international B2B automotive and motorcycle parts exhibition, successfully concluded recently. Many renowned manufacturers participated in this event, including T-Global, an expert in heat dissipation and thermal conduction technology. Leveraging the Taipei AMPA exhibition’s reputation as an industry barometer, T-Global showcased its robust capabilities in the field of heat dissipation and thermal conduction. 

2024.05.07
T-Global NEWS
University Student Dandelion Project(Taiwan Tech Racing Team)

University Student Dandelion Project(Taiwan Tech Racing Team)

Taiwan Tech Racing Team Achieves Impressive Results in Australia Expedition, winning the Best Contribution Award on their debut return to Taiwan. Among the battery modules, the TIM material was sponsored by T-Global Technology, utilizing the highest thermal conductivity TG-A1780 thermal pad, in active support of young students' pursuit of excellence and passion.

2024.04.03
T-Global NEWS
What is chip cold plate liquid cooling?

What is chip cold plate liquid cooling?

The cold plate of a chip is placed above the heat-generating components (CPU, GPU, memory modules) and absorbs and removes the heat from the chip through either single-phase or two-phase cold plates. Single-phase cold plate liquid cooling uses coolant circulating through the cold plate via the CDU to absorb the heat from the server.

2024.04.01
Educational Materials
Future Materials: The Combination of Graphene and Perovskite Achieves Advances in the Solar Energy Field

Future Materials: The Combination of Graphene and Perovskite Achieves Advances in the Solar Energy Field

The combination of graphene and perovskite has proven to be a highly promising pairing. Perovskite refers to a class of materials with the same crystal structure as the mineral perovskite (CaTiO3), which was the first discovered perovskite crystal. Perovskite materials exhibit high efficiency in absorbing photons and converting them into electric current, making them a potential silicon alternative in solar cells. As silicon solar cells approach their theoretical efficiency limits, perovskite solar cells are emerging as a cost-effective, lightweight, and flexible solar alternative.

2024.03.01
Industry Trends
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