FAQs

A vapor chamber is a vacuum chamber with microstructured walls. When heat is transferred from the heat source to the evaporation zone, the working fluid inside the chamber will begin to vaporize in the liquid phase in a low vacuum environment. At this point, the working fluid absorbs heat and expands rapidly, and the working substance in the vapor phase quickly fills the chamber. When the vapor phase working fluid comes into contact with a colder area, condensation occurs. The heat accumulated during evaporation is released through the phenomenon of condensation and the condensed liquid phase working fluid is returned to the evaporative heat source by capillary phenomena in the microstructure. The process is repeated in the chamber and this is how the vapor chamber operates.

For silicone based thermal interface materials, it is important to select the correct thickness to maintain a compression rate of 15-20% for the material. The appropriate compression level will vary depending on the softness of the material.

Thermal interface materials include thermal pads, thermal tape, thermal grease and thermal putty. By filling the gap (0.1mm-20mm) between the chip/heating element and the heat sink, the medium for accelerating heat transfer can effectively conduct heat from the chip to the heat sink fin, thus reducing the chip temperature, increasing the chip life and product performance.

Most of the thermal pad products have silicone oil in them. T-Global has solved the problem of silicone oil precipitation through two high temperature chemical treatments and vacuum treatment. The company has also solved the problem of oil seepage by developing a non-silicone PC series thermal material.

Thermal tape, also known as double-sided thermal adhesive tape, has high thermal conductivity, high viscosity and low thermal impedance, and can effectively replace thermal grease and mechanical fixing characteristics, and is used to fill the uneven gap between the heat source and the metal product, and bring the heat generated by electronic products away to achieve the effect of cooling and heat dissipation.

Nowadays, the power supply of the motherboard has a higher heating capacity, but since the mos tube is not flat, it is not convenient to spread thermal grease, so a thermal pad can be attached to it.

Thermal paste (also known as heat sink compound, thermal silicone grease, high thermal conductivity thermal paste, chip thermal paste)
is a viscous fluid substance that is filled between components with incomplete flat and smooth surfaces. This compound, with a higher thermal conductivity than air, can effectively enhance the heat dissipation of components.

here is no single standard for how thermal grease should be applied, but the rule is that it should be applied evenly, without air bubbles, without impurities and as thinly as possible.

Heat spreader base materials can be classified as silicon and non-silicone based, most of the thermal interface materials are based on silicon.

Steps for selecting the right thermal material