FAQ

The importance of Thermal Conductivity

The importance of thermal conductivity:

The thermal conductivity and heat dissipation capability of the heat sink is closely related to the life and performance of electronic products.

Thermally conductive materials or thermally conductive interface materials with high thermal conductivity have a higher ability to directly conduct thermal energy. Thermal conductivity has a variety of different names, the common ones are thermal conductivity, heat transfer, heat transfer, thermal conductivity, thermal conductivity, thermal conductivity, thermal conductivity, thermal conductivity, and thermal conductivity.

 

Key Parameters of Thermal Interface Materials – Thermal Conductivity:

Heat Transfer Coefficient (Heat Transfer Coefficient) Also known as heat transfer coefficient (k), the unit is W/mK, the thermal conductivity formula is k = (Q) *L/(Ac*ΔT), where k is the heat transfer coefficient (W/m.k ), Q is the heat (W), L is the heat conduction distance (m), Ac is the cross-sectional area (m2) of the heat transfer through the object, ΔT is the temperature difference between the cold and hot ends; it is used to measure the heat energy that can be conducted per unit time.

The key parameter for designing thermal interface materials is thermal conductivity. It is not necessary to select the product with the best performance (high K value). Hardness, thickness, and heat dissipation area are also important design considerations. When other parameters are equal, higher thermal conductivity represents more effective thermal management.

 

Reference table of thermal conductivity of different substances at room temperature:

Material Thermal conductivity (W/m.K) Material Thermal conductivity (W/m.K)
Diamond 2300 Water (l) 0.613
Silver 429 Human Skin 0.37
Copper 401 Wood 0.17
Gold 317 Helium 0.152
Aluminum 237 Soft rubber 0.13
Iron 80.2 Fiberglass 0.043
Mercury 8.54 Air 0.026
Glass 1.4 Rigid polyurethane 0.026
Brick 0.72 Foamed Rigid Urethane 0.026
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