TG-A96AB / A96AB Potting Compound
●Epoxy based material with high hardness for support
●Protect components from any effect after curing
●Can be applied with dispenser
●Room temperature or heating curing
A96AB is an epoxy potting compound with 2.6W/m•K thermal conductivity. It is mixed with an AB agent. It is made with epoxy resin (Epoxy) as the base material. It has good thermal conductivity, insulation, and waterproof gas characteristics. It can be used by a dispenser and used in Maturation at room temperature or heating.
Application
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
In a wide range of temperature and humidity changes, it can reliably protect sensitive circuits and components for a long time. This compound has high waterproof and insulating properties and high hardness. It can be used for support. It cannot be opened after potting. It is especially suitable for potting products with thermal conductivity requirements. Protect. Suitable for insulation and thermal conductivity potting of electronics, transformers, and industrial controllers.
Property table
| Properties | Unit | TG-A96AB / A96AB | Tolerance | Test Method | |
| Thermal Conductivity |
W/m•K |
2.6 |
±0.25 |
ASTM D5470 Modified |
|
| Color |
– |
White/ Black |
– |
– |
|
| Dielectric Breakdown Voltage |
KV/mm |
≥11 |
– |
ASTM D149 |
|
| Weight Loss |
% |
<1 |
– |
ASTM E595 Modified |
|
| Density |
g / cm3 |
2.5 |
±5% |
ASTM D792 |
|
| Operating Temperature |
°C |
-25~+150 |
– |
– |
|
| Viscosity |
Pa·s |
1.8~2.5 |
– |
Brookfield |
|
| Curing Time @25° C | Hrs | 12 | – | – | |
| Curing Time @80° C | Hrs | 0.5 | – | – | |
| Standard package |
– |
Pot |
– |
– |
|
| Hardness |
Shore A |
68 |
±10 |
ASTM D2240 |
|
| Mixing Ratio | gram | 13:1 | – | – | |
|
●Compliance with REACH ●Compliance with RoHS Component A is a mixed material of epoxy and thermal conductive powder. It is normal to cause precipitation and stratification due to different density. |
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(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
-
●Good thermal conductivity
-
●Protect based material with high hardness for support
-
●A:B=1:1
-
●Room temperature or heating curing
TG-A09AB / TG-S09AB: is the thermally conductive sealant product newly developed by T-Global in 2022, Compared with the same type of silicone thermal conductive sealant, the thermal conductivity can reach 2.8W/m•K, it only takes 18 hours to cure the room temperature, and it only takes 30 minutes to heat and cure. After curing, it can protect electronic parts and prevent moisture and protect.