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SOLUTIONS

Comprehensive Heat Dissipation Engineering Services Entrusted to T-Global Technology

Heat Dissipation Product Series Introduction

PRODUCT

Comprehensive Thermal Engineering Products

Thermal Simulation

Vapor Chambers

Heat Pipes

Thermal Interface Materials

Heat Sinks

Flexible Absorbing Materials

PRODUCT CATEGORY
PRODUCT CATEGORY

About Us

ABOUT T-Global

The global first choice for heat dissipation products, meeting your needs.

T-Global products and services solve your heat dissipation problems. We pride ourselves on our culture of being forward-looking, targeting the future of new energy, 5G, electric vehicles and other emerging technologies, and focusing on building long-term, stable relationships with our partners to earn the trust of our customers, partners and employees.

  • CONSULTATION

    CONSULTATION

    Dedicated consultation

  • 14 DAYS

    14 DAYS

    The fastest delivery time is 14 days

  • CUSTOMIZED

    CUSTOMIZED

    Customized production

  • NO MOQ

    NO MOQ

    No minimum order quantity

  • THERMAL SIMULATION

    THERMAL SIMULATION

    Thermal Simulation Analysis Services

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LATEST NEWS

Global Thermal Solutions: Your Ultimate Choice

Electronica 2024
Events
12

24.Nov

Electronica 2024

Trade Fair Center Messe München
Booth:Hall B6.328/1

How Does a Liquid Cooling System Work? What Are the Components?
Blog
17

24.Oct

How Does a Liquid Cooling System Work? What Are the Components?

Do you know how a liquid cooling system works and what its components, applications, and future trends are? Don't go anywhere, and continue reading.

Types of Heat Pipes: Exploring Versatility in Thermal Management
Blog
08

24.Oct

Types of Heat Pipes: Exploring Versatility in Thermal Management

The exploration covers the types of heat pipes, including vapor chamber, variable conductance, and more, underscoring their diversity and adaptability.

[New Product Launch] Low Bleed Series Thermal Pad
Product News
12

24.Jun

[New Product Launch] Low Bleed Series Thermal Pad

The properties of thermal conduction materials employed directly affect the performance and life span of electronics with high-speed computing and processing abilities.

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