Thermal Interface Material
Thermal Putty
●Silicone-type spacer with great long term reliability
●Lower thermal resistance than thermal pads
●Physical property between liquid and solid state
●Elimination of different gap between heat source and the heatsink
●Can be applied with dispenser
Application
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
Property table
| TG4040 Putty | TG6060 Putty | |||||||||
| Time | Initial | 200 Hr | 400 Hr | 700 Hr | 1000 Hr | Initial | 200 Hr | 400 Hr | 700 Hr | 1000 Hr |
| 125℃ Aging | 0.058 | 0.059 | 0.060 | 0.059 | 0.060 | 0.052 | 0.051 | 0.050 | 0.052 | 0.052 |
| 160℃ Aging | 0.058 | 0.059 | 0.060 | 0.060 | 0.059 | 0.052 | 0.052 | 0.051 | 0.052 | 0.051 |
| 85℃ / 85% RH | 0.058 | 0.059 | 0.060 | 0.059 | 0.060 | 0.052 | 0.051 | 0.050 | 0.052 | 0.051 |
| Properties |
TG4040 PUTTY |
TG6060 PUTTY |
Unit | Tolerance | Test Method |
| Thermal Conductivity |
3.2 |
6.3 |
W / mK |
±0.3 |
ASTM D5470 |
| Color |
Blue |
Blue |
– |
– |
Visual |
| Solid content |
100 (one-part) |
100 (one-part) |
% |
– |
– |
| Viscosity 0.5rpm |
3,000 |
2.500~3.000 |
Pa·s |
– |
Brookfield |
| Density |
3 |
3.3 |
g / cm3 |
– |
ASTM D792 |
| Volume Resistivity |
1013 |
1013 |
Ohm-m |
– |
ASTM D257 |
| Working Temperature |
-50~180 |
-50~180 |
°C |
– |
– |
| Standard package |
90g/ 165g/ 1KG |
99g/181g/1KG |
Tube/Pot |
– |
– |
| ●Need samples? | |||||
(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
●Silicone free thermal gel
●Shapeable and compressible
●Low thermal resistance
●No fluidity
●Best for north bridge IC
●Silicone-type spacer with great long term reliability
●Lower thermal resistance than thermal pads
●Physical property between liquid and solid state
●Elimination of different gap between heat source and the heatsink
●Can be applied with dispenser
●Good thermal conductivity
●Heat curing
●Can be applied with pistol
●Low viscosity
●Easy to assemble