Thermal Interface Material

Thermal Putty

TG-NSP25 Non-Silicone Thermal Putty
TG-NSP25 Non-Silicone Thermal Putty
TG-NSP25 Non-Silicone Thermal Putty
TG-NSP25 Non-Silicone Thermal Putty
TG-NSP25 Non-Silicone Thermal Putty

●Silicone free thermal gel

●Shapeable and compressible

●Low thermal resistance

●No fluidity

●Best for north bridge IC

Application

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

Property table

Thermal Impedance Initial 200Hr 400Hr 700Hr 1000Hr
125℃ Aging 0.050 0.051 0.050 0.051 0.052
85℃ / 85% RH 0.050 0.049 0.049 0.049 0.050

 

 

Properties TG-NSP25 Unit Tolerance Test Method
Thermal Conductivity 

2.6

W / mK

±0.25

ASTM D5470

Color

Gray 

Visual

Solid Content 

100

%

Viscosity 0.5rpm 

5000

Pa·s

Brookfield

Density 

2.6

g / cm3

ASTM D792

Low MW Siloxane (D4-10) 

0

ppm

GC/MS

Volume Resistivity 

1014

Ohm-m

ASTM D257

Working Temperature 

-50~150

°C

Standard Package

78g/ 143g/ 1KG

Tube/Pot

●Need samples?

(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)

Related materials Recommended

TG4040 Putty Thermal Putty

●Silicone-type spacer with great long term reliability

●Lower thermal resistance than thermal pads

●Physical property between liquid and solid state

●Elimination of different gap between heat source and the heatsink 

●Can be applied  with dispenser

Submit
TG6060 Putty Thermal Putty

●Silicone-type spacer with great long term reliability

●Lower thermal resistance than thermal pads

●Physical property between liquid and solid state

●Elimination of different gap between heat source and the heatsink 

●Can be applied  with dispenser

Submit
S730 Potting Compound

●Good thermal conductivity

●Heat curing

●Can be applied with pistol

●Low viscosity

●Easy to assemble

Submit
TOP