TG-A38KF High Performance Thermal Pad
TG-A38KF High Performance Thermal Pad

TG-A38KF High Performance Thermal Pad

  • ●Great thermal conductivity

  • ●Difficult to be deformed

  • ●Easy to assemble

  • ●Fiberglass on one side


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TG-A38KF is a soft gap filling material, glass fiber thermal conductive silicon film with thermal conductivity of 3.3W/m•K. This material has excellent thermal performance under low pressure. One mask is self-adhesive. On the other hand, because of its glass fiber characteristics, it can effectively increase the withstand voltage strength, and it is resistant to shear and tear, not easy to deform, and it has good thermal conductivity.

Application

Suitable for low-power products 

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

TG-A38K is formulated with unique 3.3W/m•K thermal conductivity. It also has excellent thermal conductivity under elevated pressure. In addition, this material has excellent self-adhesiveness, even if it encounters high roughness, and it can also show its high-performance bonding effect. Ideal for high-performance applications that require low assembly stress. This product is mostly used in applications such as the telecommunications industry, ASIC and DSP, consumer electronic products, and cooling modules. 

 

Tearing off the
release paper.
Gently attach the thermally
conductive silicon pad to the
heat source.
Remove the
protective film
Apply components onto
the exposed part and
apply pressure at fixture.

 

  TG-A20KX TG-A2200 TG-A3500 TG-A38KX TG-A4500
Thermal Conductivity 2.0 2.2 3.5 3.8 4.5
Dielectric Breakdown ≥12 ≥13 ≥13 ≥10 ≥10
Hardness (Shore00) 55 15 35 60 50

 

  TG-A6200 TG-A1250 TG-A1450 TG-A1660 TG-A1780
Thermal Conductivity 6.2 12.5 14.5 16.6 17.8
Dielectric Breakdown ≥10 ≥10 ≥8 ≥7 ≥8
Hardness (Shore00) 50 55 55 65 70

 

Thermal Conductivity
Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage
Dielectric breakdown is the failure of an insulating material to prevent the flow of current
under an applied electrical stress.
Hardness
Higher numbers on the scale indicate a greater resistance to indentation
and thus harder materials.

Property table

Properties Unit TG-A38KF Tolerance Test Method
Thermal Conductivity

W/m•K

3.3

±10%

ASTM D5470 Modified

Thickness

mm

0.5~ 10.0

ASTM D374

inch

0.0197~ 0.394

ASTM D374

Color

Blue 

Colorimeter CIE 1976

Reinforcement Carrier  Fiberglass mesh 
Flame Rating

V-0

UL 94

Dielectric Breakdown Voltage

KV / mm

≥10

ASTM D149

Weight Loss

%

<1

ASTM E595 Modified

Density

g / cm3

3.1

±5%

ASTM D792

Operating Temperature °C -40 ~ +200
Volume Resistivity Ohm-m 3x1012 ASTM D257
Elongation

%

110 (Silicone Side)

ASTM D412

Standard Format

Sheet 

Hardness

Shore OO

60 (Silicone Side)

±8

ASTM D2240

●For thicknesses less than 1.0mm, hardness will be adjusted to 50-75 Shore OO to facilitate effective removal of liner during production
●Different tolerances according to the selected thickness
●Need samples?
●Die-cut for different shapes

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