TG-A38KF High Performance Thermal Pad
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●Great thermal conductivity
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●Difficult to be deformed
-
●Easy to assemble
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●Fiberglass on one side
●Great thermal conductivity
●Difficult to be deformed
●Easy to assemble
●Fiberglass on one side
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A38KF is a soft gap filling material, glass fiber thermal conductive silicon film with thermal conductivity of 3.3W/m•K. This material has excellent thermal performance under low pressure. One mask is self-adhesive. On the other hand, because of its glass fiber characteristics, it can effectively increase the withstand voltage strength, and it is resistant to shear and tear, not easy to deform, and it has good thermal conductivity.
Application
【Suitable for low-power products 】
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
TG-A38K is formulated with unique 3.3W/m•K thermal conductivity. It also has excellent thermal conductivity under elevated pressure. In addition, this material has excellent self-adhesiveness, even if it encounters high roughness, and it can also show its high-performance bonding effect. Ideal for high-performance applications that require low assembly stress. This product is mostly used in applications such as the telecommunications industry, ASIC and DSP, consumer electronic products, and cooling modules.
Tearing off the release paper. |
Gently attach the thermally conductive silicon pad to the heat source. |
Remove the protective film |
Apply components onto the exposed part and apply pressure at fixture. |
TG-A20KX | TG-A2200 | TG-A3500 | TG-A38KX | TG-A4500 | |
---|---|---|---|---|---|
Thermal Conductivity | 2.0 | 2.2 | 3.5 | 3.8 | 4.5 |
Dielectric Breakdown | ≥12 | ≥13 | ≥13 | ≥10 | ≥10 |
Hardness (Shore00) | 55 | 15 | 35 | 60 | 50 |
TG-A6200 | TG-A1250 | TG-A1450 | TG-A1660 | TG-A1780 | |
---|---|---|---|---|---|
Thermal Conductivity | 6.2 | 12.5 | 14.5 | 16.6 | 17.8 |
Dielectric Breakdown | ≥10 | ≥10 | ≥8 | ≥7 | ≥8 |
Hardness (Shore00) | 50 | 55 | 55 | 65 | 70 |
Thermal Conductivity Thermal conductivity refers to the ability of a given material to conduct/transfer heat. |
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Dielectric Breakdown Voltage Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress. |
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Hardness Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials. |
Property table
Properties | Unit | TG-A38KF | Tolerance | Test Method |
Thermal Conductivity |
W/m•K |
3.3 |
±10% |
ASTM D5470 Modified |
Thickness |
mm |
0.5~ 10.0 |
– |
ASTM D374 |
inch |
0.0197~ 0.394 |
– |
ASTM D374 |
|
Color |
– |
Blue |
– |
Colorimeter CIE 1976 |
Reinforcement Carrier | – | Fiberglass mesh | – | – |
Flame Rating |
– |
V-0 |
– |
UL 94 |
Dielectric Breakdown Voltage |
KV / mm |
≥10 |
– |
ASTM D149 |
Weight Loss |
% |
<1 |
– |
ASTM E595 Modified |
Density |
g / cm3 |
3.1 |
±5% |
ASTM D792 |
Operating Temperature | °C | -40 ~ +200 | – | – |
Volume Resistivity | Ohm-m | 3x1012 | – | ASTM D257 |
Elongation |
% |
110 (Silicone Side) |
– |
ASTM D412 |
Standard Format |
– |
Sheet |
– |
– |
Hardness |
Shore OO |
60 (Silicone Side) |
±8 |
ASTM D2240 |
●For thicknesses less than 1.0mm, hardness will be adjusted to 50-75 Shore OO to facilitate effective removal of liner during production |
Related materials Recommended
-
●Great thermal conductivity
-
●Difficult to be deformed
-
●Easy to assemble
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A38KX has great thermal conductivity, it’s difficult to be deformed and easy to assemble. With Protection, impact absorption, flame resistance, and good fit.
-
●Great thermal conductivity
-
●Difficult to be deformed
-
●Easy to assemble
-
●Fiberglass on one side
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A20KF is a glass fiber thermal conductive silicone material with1.8W/m•K thermal conductivity. At the same time, it has self-adhesive, glass fiber features, is puncture-resistant, and is not easy to deform. Normal operation at -40 to +180 degrees C, not only safe but also for applications that need to provide heat sinks for the device and high-voltage equipment, it can also produce great heat conduction benefits, providing excellent heat conduction and insulation performance.
-
●Great thermal conductivity
-
●Difficult to be deformed
-
●Easy to assemble
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.TG-A20KX - is a new product developed by T-Global in the year 2020. It is a thermally conductive silicone film with 2.0W/m•K thermal conductivity and the thermal conductivity is hard to deform, it has a good structure and good thermal conductivity, and double-mask self-adhesiveness. It effectively reduces the thermal resistance between the surface of the heat source and the contact surface of the heat sink