Thermal Interface Material
Thermal Pad
●Very good thermal conductivity
●High compressibility and compliancy
●Natural tack
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Application
Thermal pad with good thermal conductivity, often used in the middle gap of battery modules
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
Property table
| Properties | TG-A3500 | Unit | Tolerance | Test Method |
| Thermal Conductivity |
3.5 |
W / mK |
±1.4 |
ASTM D5470 |
| Thickness |
0.5~8.0 |
mm |
– |
ASTM D374 |
|
0.0197~0.315 |
inch |
– |
ASTM D374 |
|
| Color |
yellow |
– |
– |
Visual |
| Flame Rating |
V-0 |
– |
– |
UL 94 |
| Dielectric Breakdown Voltage |
10 |
KV / mm |
- |
ASTM D149 |
| Weight Loss |
<1 |
% |
– |
ASTM E595 |
| Density |
2.3 |
g / cm3 |
±0.2 |
ASTM D792 |
| Working Temperature | -50 ~ +150 | °C | – | – |
| Volume Resistance | 8x1012 | Ohm-m | – | ASTM D257 |
| Elongation |
80 |
% |
– |
ASTM D412 |
| Standard Shape |
Sheet ones |
– |
– |
– |
| Hardnes |
30 |
Shore 00 |
±15 |
ASTM D2240 |
|
●Compliance with REACH ●Compliance with RoHS ●Compliance with UL |
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● Need samples? ●Pre-cut for different shapes |
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(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
●High thermal conductivity
●High compressibility and compliancy
●Natural tack
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
●Very good thermal conductivity
●High compressibility and compliancy
●Natural tack
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
●One side is non-sticky and easy to assemble
●Ultra soft and good compressibility
●Good insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.