Thermal Interface Material

Thermal Pad

TG-A3500 Ultra Soft Thermal Pad
TG-A3500 Ultra Soft Thermal Pad

●Very good thermal conductivity

●High compressibility and compliancy

●Natural tack


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Application

Thermal pad with good thermal conductivity, often used in the middle gap of battery modules 

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

Property table

Properties TG-A3500 Unit Tolerance Test Method
Thermal Conductivity

3.5

W / mK

±1.4

ASTM D5470

Thickness

0.5~8.0

mm

ASTM D374

0.0197~0.315

inch

ASTM D374

Color

yellow

Visual

Flame Rating

V-0

UL 94

Dielectric Breakdown Voltage

10

KV / mm

-

ASTM D149

Weight Loss

<1

%

ASTM E595

Density

2.3

g / cm3

±0.2

ASTM D792

Working Temperature -50 ~ +150 °C
Volume Resistance 8x1012 Ohm-m ASTM D257
Elongation

80

%

ASTM D412

Standard Shape

Sheet ones

Hardnes

30

Shore 00

±15

ASTM D2240

●Compliance with REACH  ●Compliance with RoHS  ●Compliance with UL

● Need samples?

●Pre-cut for different shapes

(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)

Related materials Recommended

TG-A6200 Ultra Soft Thermal Pad

●High thermal conductivity

●High compressibility and compliancy

●Natural tack


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
TG-A4500 Ultra Soft Thermal Pad

●Very good thermal conductivity

●High compressibility and compliancy

●Natural tack


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
TG-A2200 Ultra Soft Thermal Pad

●One side is non-sticky and easy to assemble

●Ultra soft and good compressibility

●Good insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
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