Thermal Interface Material

Thermal Pad

TG-A20KX Thermal Pad
TG-A20KX Thermal Pad

●Great thermal conductivity

●Difficult to be deformed

●Easy to assemble


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Application

【Suitable for low-power products 】

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

Property table

Properties TG-A20KX Unit Tolerance Test Method
Thermal Conductivity 2

W / mK

±10%

ASTM D5470

Thickness

0.5~ 10.0

mm

ASTM D374

0.197~ 0.394

inch

ASTM D374

Color

Dark Gray 

Visual

Flame Rating

V-0

UL 94

Dielectric Breakdown Voltage

>5

KV / mm

±10%

ASTM D149

Weight Loss

<1

%

ASTM E595

Density

2

g / cm3

±10%

ASTM D792

Working Temperature -40 ~ +180 °C
Volume Resistance 3x1012 Ohm-m ASTM D257
Elongation

160

%

ASTM D412

Standard Shape

Sheet ones

Hardness 55

Shore 00

±8

ASTM D2240

●Need samples?

●Pre-cut for different shapes

 

Related materials Recommended

TG-A38KF High Performance Thermal Pad

●Great thermal conductivity

●Difficult to be deformed

●Easy to assemble

●Fiberglass on one side


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
TG-A38KX High Performance Thermal Pad

●Great thermal conductivity

●Difficult to be deformed

●Easy to assemble


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
TG-A20KF Thermal Pad

●Great thermal conductivity

●Difficult to be deformed

●Easy to assemble

●Fiberglass on one side


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
TOP