Thermal Interface Material

Thermal Pad

TG-A1450 Ultra Soft Thermal Pad
TG-A1450 Ultra Soft Thermal Pad

●High thermal conductivity

●Low thermal impedance

●Good insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Application

Best for high power applications, high-wattage electronics such as electric vehicles, automation, 5G applications, servers, etc. 

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

Property table

Properties TG-A1450 Unit Tolerance Test Method
Thermal Conductivity

14.5

W / mK

±1.4

ASTM D5470

Thickness

0.5~ 2.0

mm

ASTM D374

0.0197~ 0.0787

inch

ASTM D374

Color

Red

Visual

Flame Rating

V-0

UL 94

Dielectric Breakdown Voltage

4

KV / mm

-

ASTM D149

Weight Loss

<1

%

ASTM E595

Density

3.6

g / cm3

±0.2

ASTM D792

Working Temperature -50 ~ +150 °C
Volume Resistance 7x1012 Ohm-m ASTM D257
Elongation

30

%

ASTM D412

Standard Shape

Sheet ones

Hardnes

60

Shore 00

±5

ASTM D2240

●Compliance with REACH  ●Compliance with RoHS  ●Compliance with UL

● Need samples?

●Pre-cut for different shapes

(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)

Related materials Recommended

TG-A1780 Ultra Soft Thermal Pad

●High thermal conductivity

●Low thermal impedance

●Good insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
TG-A1660 Ultra Soft Thermal Pad

●High thermal conductivity

●Low thermal impedance

●Good insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
TG-A1250 Ultra Soft Thermal Pad

●High thermal conductivity up to 12.5 W/mK

●Low thermal resistance

●High compressibility and compliancy

●Electrical insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
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