Thermal Interface Material
Potting Compound
●Good thermal conductivity
●Room temperature curing
●High stability
●Water proof
Application
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
Property table
| Properties | S720AB | Unit | Tolerance | Test Method |
| Thermal Conductivity |
0.8 |
W / mK |
±0.08 |
ASTM D5470 |
| Color |
White |
– |
– |
Visual |
| Dielectric Breakdown Voltage |
6 |
KV/mm |
±0.6 |
ASTM D149 |
| Weight Loss |
<1 |
% |
– |
ASTM E595 |
| Density |
1.97 |
g / cm3 |
±0.2 |
ASTM D792 |
| Working Temperature |
-40~180 |
°C |
– |
– |
| Viscosity |
2000~3000 |
cps |
– |
ASTM D2393 |
| Standard Package |
1KG |
Pot |
– |
– |
| Hardness |
40~50 |
Shore A |
±4~5 |
ASTM D2240 |
| Curing Time @25°C | 35 | Hrs | – | – |
| Mixing ratio | 100:2 | gram | – | – |
| ●Compliance with REACH ●Compliance with RoHS | ||||
| ●Need samples? | ||||
(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
●Silicone free thermal gel
●Shapeable and compressible
●Low thermal resistance
●No fluidity
●Best for north bridge IC
●Epoxy based material with high hardness for support
●Protect components from any effect after curing
●Can be applied with dispenser
●Room temperature or heating curing
●Good thermal conductivity
●Heat curing
●Can be applied with pistol
●Low viscosity
●Easy to assemble