Thermal Interface Material
Thermal Grease
●Good thermal conductivity
●Easy to assemble
●High stability
Application
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
Property table
| Properties | S606B | S606C | Unit | Tolerance | Test Method |
| Thermal Conductivity |
1.8 |
5 |
W/mK |
±10% |
ASTM D5470 |
| Color |
White |
Gray |
– |
– |
Visual |
| Oil Dispersible |
<0.2 |
<0.05 |
% |
– |
24hrs at 150°C |
| Weight Loss |
<0.5 |
<0.5 |
% |
– |
ASTM E595 |
| Density |
2.3 |
2.3 |
g/cm3 |
±10% |
ASTM D792 |
| Working Temperature |
-40~+180 |
-40~+180 |
°C |
– |
– |
| Viscosity |
30 |
125 |
Pas |
– |
ASTM D2196 |
| Standard Package |
1KG |
1KG |
Pot |
– |
– |
| Volume Resistance |
>1011 |
>1012 |
Ohm- m |
– |
ASTM D257 |
| Thermal Resistance |
0.06 |
0.02 |
°C – in / W |
– |
ASTM D5470 |
| ●Compliance with REACH ●Compliance with RoHS | |||||
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(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
●High thermal conductivity
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●No overflow
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●High thermal conductivity
●Good leveling agent
●No overflow
●Effectively fill the gap of the interface
●Low thermal impedance/thermal resistance
●Silicone base, no Environmental pollution