Breaking the Boundaries of M.2 SSD Thermal Module | M.2 Fan SSD Thermal Module Unlocks Next-Generation Storage Performance

Breaking the Boundaries of M.2 SSD Thermal Module | M.2 Fan SSD Thermal Module Unlocks Next-Generation Storage Performance

To meet the future demands of high-power M.2 SSD, T-Global developed the M.2 Fan SSD Thermal Module. The module is equipped with TG-A6200 Ultra-Soft Thermal Pad and integrated with a 20x20x6.5mm hydraulic bearing fan. Capable of reaching a maximum speed of 17,000 ± 20% RPM, the fan operates with a low startup voltage and current of 7.0V/0.10A, delivering stable and powerful airflow to ensure effective cooling.

2025.10.02
Product News
Tackle High-Heat Challenges – TG-ASD50AB Thermally Conductive Gel Officially Launched

Tackle High-Heat Challenges – TG-ASD50AB Thermally Conductive Gel Officially Launched

Discover TG-ASD50AB with 5.0 W/m·K thermal conductivity, optimized for 5G, EV, servers, and smart devices. RoHS & REACH compliant, ideal for high-efficiency thermal management.

2025.07.22
Product News
Vapor Chamber vs. Heat Pipe: What's the Difference?

Vapor Chamber vs. Heat Pipe: What's the Difference?

Learn the differences between vapor chamber vs. heat pipe electronic cooling technologies and how to pick one for thermal management in your devices.

2025.07.01
Blog
Thermal Paste vs. Thermal Pad: Side-by-Side Comparison

Thermal Paste vs. Thermal Pad: Side-by-Side Comparison

Learn thermal paste vs. thermal pad composition, thermal conductivity, application, durability, and ideal heat management use cases in this guide.

2025.06.17
Blog
Thermal Management Solutions

Thermal Management Solutions

T-Global provides thermal management solutions for industry-specific expertise, cutting-edge products, and customized support for greater performance.

2025.06.01
Blog
Understanding Vapor Chamber Cooling in Thermal Management

Understanding Vapor Chamber Cooling in Thermal Management

Find out how vapor chamber cooling provides efficient and compact solutions for high-performance devices, altering thermal management in electronics.

2025.05.31
Blog
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