全てのアイテム

製品情報

熱シミュレーション

●Reducing R&D costs
●Save R&D time
●Technology Cooperation Trends

ベイパーチャンバー

●Quickly cool down 
●3D heat transfer structure
●Flexible accessory combination

ヒートパイプ

●Quickly solve single point heating
●Large heat transfer, highly efficient
●Small size and weight, High flexibility

熱伝導材料

●Diverse product selection
●High customization flexibility
●Effectively reduce thermal resistance 

ヒートシンク

●Efficiency improvement for module
●Good choice for heat dissipation 
●Small Quantity Available

ペルチェ素子

●Control temperature easily
●Small size, Light weight
●High reliability

電磁波吸収シート

●Ultra-thin and flexible
●Effectively suppress interference
●Excellent performance

ファン

●Forced convection preferred 
●Small Quantity Available
●Customized cooling module

TOP