In the field of thermal management technology, to solve the problem of electronic heat dissipation
The first step is to observe the basic laws of conduction, convection and radiation.
The second step is to separate the heat. The use of heat sinks as a method of heat dissipation and the use of increased heat dissipation areas are common design approaches in electronic heat dissipation requirements.
The space constraints of a heatsink sometimes make it impossible to add much area for cooling purposes. From a convection point of view, increasing the area also increases the resistance, which is not always effective. In addition, increasing the area of heat dissipation means increasing the weight and therefore the cost. However, heat sinks are still the most cost-effective thermal management technology, and can be used to boost thermal conductivity by improving material properties, or to enhance convection by changing the shape of the surface, or by adjusting the temperature difference.
Heat sinks are classified by mechanical processing, including extrusion, casting, forging, cutting and others, with varying effects, processes and costs. The cost of production and performance must be considered in order to maximize the benefits of the heat sink. Different materials can be chosen to improve the thermal conductivity of the heat sink. The thermal conductivity of copper is 70% higher than that of aluminum, however, the weight and cost of copper is higher than that of aluminum and there are many other highly thermally conductive materials such as graphite that can be applied.
The shape of the heatsink also affects the conductivity, convection and radiation effects, and the number of fins in the heatsink has a direct bearing on weight and cost. The heat dissipation effect varies depending on the surface treatment of the heat sink. In the case of radiation, which accounts for approximately 20% of the natural heat dissipation, blackening the surface of the object is beneficial to radiation. Generally speaking, anodizing can increase the radiation performance and hence the heat dissipation efficiency. The choice is based on the thermal application, limitations, conductivity and cost requirements.
Today's thermal designs often combine a number of thermal components such as thermal interface materials, heat sinks, heat pipes, aluminum fins and fans. The thermal management of electronic products can only be achieved by analyzing each application scenario and its limitations with software.

Editorial staff T-Global Marketing

Author T-Global R&D team Team introduction – A team of professional heat flow engineers, with independent and innovative research and development, provides customers with preliminary thermal simulation planning and institutional heat dissipation design consulting. In the face of evolving market trends, they can quickly respond and continue to provide innovative anti-heat solutions.