Thermal Interface Material

Potting Compound

A96 AB Potting Compound
A96 AB Potting Compound
A96 AB Potting Compound
A96 AB Potting Compound
A96 AB Potting Compound

●Epoxy based material with high hardness for support

●Protect components from any effect after curing

●Can be applied with dispenser

●Room temperature or heating curing

Application

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

Property table

Properties A96AB Unit Tolerance Test Method
Thermal Conductivity

2.6

W / mK

±0.25

ASTM D5470

Color

White/ Black

Visual

Dielectric Breakdown Voltage

10.2

KV/mm

±1

ASTM D149

Weight Loss

<1

%

ASTM E595

Density 

1.8

g / cm3

±0.2

ASTM D792

Working Temperature

-25~150

°C

Viscosity

1800~2500

cps

ASTM D2393

Standard package

1KG

Pot

Hardness

68

Shore A

±8

ASTM D2240

Curing Time @25°C 35 Hrs
Curing Time @80°C 1.5 Hrs
Mixing ratio 13:1 gram
●Compliance with REACH  ●Compliance with RoHS
●Need samples?

(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)

Related materials Recommended

TG-NSP25 Non-Silicone Thermal Putty

●Silicone free thermal gel

●Shapeable and compressible

●Low thermal resistance

●No fluidity

●Best for north bridge IC

Submit
S730 Potting Compound

●Good thermal conductivity

●Heat curing

●Can be applied with pistol

●Low viscosity

●Easy to assemble

Submit
S720 AB Potting Compound

●Good thermal conductivity

●Room temperature curing

●High stability 

●Water proof 

Submit
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